Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group

Ultra-dense Silicon Photonics Coupling Solution for Optical Chip Scale Package Transceiver

Not Accessible

Your library or personal account may give you access


We propose a high-density, low-power optical chip scale package transceiver scheme facing future high capacity network. With novel ultra-dense SiPh coupling solution, OCSP with 336 channels is achievable in scenarios of edge and surface coupling.

© 2016 Optical Society of America

PDF Article
More Like This
Multi-core Fiber Socket-Assisted Packaging for 84-Channel Ultra-dense Silicon Photonics IO

Gligor Djogo, Stephen Ho, Moez Haque, Erden Ertorer, Jianzhao Li, Jun Liu, Xiaolu Song, Jing Suo, and Peter R. Herman
Tu2A.7 Optical Fiber Communication Conference (OFC) 2019

High Density Silicon Photonic Integrated Transceiver Chip with 1.2 Tbps Capacity

Zhen Dong, Xiaolu Song, Yanbo Li, Lei Gao, Qing Zhao, Shengmeng Fu, and Li Zeng
AF4F.5 Asia Communications and Photonics Conference (ACPC) 2016

Novel Optical Fibers for Silicon Photonic Chip Packaging

Ming-Jun Li
SM2O.1 CLEO: Science and Innovations (CLEO_SI) 2020


You do not have subscription access to this journal. Citation lists with outbound citation links are available to subscribers only. You may subscribe either as an Optica member, or as an authorized user of your institution.

Contact your librarian or system administrator
Login to access Optica Member Subscription

Select as filters

Select Topics Cancel
© Copyright 2023 | Optica Publishing Group. All Rights Reserved