Abstract

We present a complete process flow for fabrication of integrated GaP-on-insulator photonic devices via direct wafer bonding of epitaxial films. High-fidelity patterning enables a range of applications, such as waveguide resonators and photonic crystal cavities.

© 2018 The Author(s)

PDF Article
More Like This
High Q Integrated Photonic Microresonators on 3C SiC-on-Insulator Platform

Tianren Fan, Hesam Moradinejad, Xi Wu, Ali A. Eftekhar, and Ali Adibi
SW4A.2 CLEO: Science and Innovations (CLEO_SI) 2018

Design of Integrated Photonic Devices on SiC-on-Insulator (SiCOI) Platform for Quantum Applications

Yanan Wang, Hao Jia, and Philip X.-L. Feng
FW1D.2 Frontiers in Optics (FiO) 2020

Hybrid Si3N4-LiNbO3 integrated platform for electro-optic conversion

Mikhail Churaev, Simon Honl, Rui Ning Wang, Charles Mohl, Tianyi Liu, J. Connor Skehan, Johann Riemensberger, Daniele Caimi, Junqiu Liu, Paul Seidler, and Tobias J. Kippenberg
STh1F.3 CLEO: Science and Innovations (CLEO_SI) 2020

References

You do not have subscription access to this journal. Citation lists with outbound citation links are available to subscribers only. You may subscribe either as an Optica member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access Optica Member Subscription