Abstract
Power-efficient, high-performance multicore systems require high-bandwidth and low-power I/O, which can not be realized without optics. This paper will review recent progress in optical interconnects, which include low-power, high-speed optical link and high-density, chip-based, high-density optical packaging on optical PCB.
© 2009 OSA, IEEE Photonics Society, SPIE, COS, CIC
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