Silicon Photonic Integrated Devices For Optical Interconnects

Di Liang; Géza Kurczveil; Chin-Hui Chen; Marco Fiorentino; Zhen Peng; Raymond G. Beausoleil

doi:10.1364/ACPC.2013.AF1A.3

Asia Communications and Photonics Conference 2013
OSA Technical Digest (online) (Optica Publishing Group, 2013),
paper AF1A.3
•https://doi.org/10.1364/ACPC.2013.AF1A.3

Silicon Photonic Integrated Devices For Optical Interconnects

Di Liang, Géza Kurczveil, Chin-Hui Chen, Marco Fiorentino, Zhen Peng, and Raymond G. Beausoleil

Asia Communications and Photonics Conference 2013

Beijing China
12–15 November 2013
ISBN: 978-1-55752-989-3

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Photonic Integration I (AF1A)

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D. Liang, G. Kurczveil, C. Chen, M. Fiorentino, Z. Peng, and R. G. Beausoleil, "Silicon Photonic Integrated Devices For Optical Interconnects," in Asia Communications and Photonics Conference 2013, OSA Technical Digest (online) (Optica Publishing Group, 2013), paper AF1A.3.

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Abstract

We present our latest update on key components in the integrated Si photonic interconnect system, including hybrid Si microring lasers, Si microring modulators, hybrid Si photodetector and passive waveguide devices.

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