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Conferences > ACPC > 2014 > AF3B > AF3B.4

Chip-Level Interconnections Realized Via the Laser-Induced Forward Transfer Technique

K.S. Kaur, J. Missinne, and G. Van Steenberge

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Abstract

In this paper, successful flip-chip bonding and DC characterization of single photodiode and VCSEL chips via Laser-Induced Forward Transfer (LIFT) printed micro-bumps of indium, silver nano-particle (AgNP) based inks and pastes, is reported.

© 2014 Optical Society of America

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