2D and 3D Heterogeneous Photonic Integration for Future Microsystems

S. J. Ben Yoo

doi:10.1364/ACPC.2015.AS3A.1

Asia Communications and Photonics Conference 2015
OSA Technical Digest (online) (Optica Publishing Group, 2015),
paper AS3A.1
•https://doi.org/10.1364/ACPC.2015.AS3A.1

2D and 3D Heterogeneous Photonic Integration for Future Microsystems

S. J. Ben Yoo

Asia Communications and Photonics Conference 2015

Hong Kong Hong Kong
19–23 November 2015
ISBN: 978-1-943580-06-4

From the session
Heterogeneous Integration and Device Fabrication (AS3A)

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S. J. B. Yoo, "2D and 3D Heterogeneous Photonic Integration for Future Microsystems," in Asia Communications and Photonics Conference 2015, C. Lu, J. Luo, Y. Ji, K. Kitayama, H. Tam, K. Xu, P. Ghiggino, and N. Wada, eds., OSA Technical Digest (online) (Optica Publishing Group, 2015), paper AS3A.1.

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Abstract

We will discuss 2D and 3D heterogeneous integration technologies aiming at realizing microsystems for applications in future communication, computing, and imaging systems. The 3D photonic integrated circuit (PIC) platform exploits direct inscribing of arbitrarily shaped waveguides using femtosecond lasers. Article not available.

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