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2D and 3D Heterogeneous Photonic Integration for Future Microsystems

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We will discuss 2D and 3D heterogeneous integration technologies aiming at realizing microsystems for applications in future communication, computing, and imaging systems. The 3D photonic integrated circuit (PIC) platform exploits direct inscribing of arbitrarily shaped waveguides using femtosecond lasers. Article not available.

© 2015 Optical Society of America

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