Photonic integration for Terabit scale single-wavelength on-chip Optical Interconnects

Xinru Wu; Hon Ki Tsang

doi:10.1364/ACPC.2016.AF3F.1

Asia Communications and Photonics Conference 2016
OSA Technical Digest (online) (Optica Publishing Group, 2016),
paper AF3F.1
•https://doi.org/10.1364/ACPC.2016.AF3F.1

Photonic integration for Terabit scale single-wavelength on-chip Optical Interconnects

Xinru Wu and Hon Ki Tsang

Asia Communications and Photonics Conference 2016

Wuhan China
2–5 November 2016
ISBN: 978-0-9600380-0-8

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Modulator & Photodetector (AF3F)

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X. Wu and H. K. Tsang, "Photonic integration for Terabit scale single-wavelength on-chip Optical Interconnects," in Asia Communications and Photonics Conference 2016, OSA Technical Digest (online) (Optica Publishing Group, 2016), paper AF3F.1.

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Abstract

We describe some of our recent results on using silicon photonics for high capacity on-chip interconnects, including integrated optical switches for mode division multiplexing and integrated ring modulators with advanced modulation formats for direct detection short reach interconnects.

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