2D and 3D Heterogeneously Photonic Integrated Circuits for future Computing and Networking Systems

S. J. Ben Yoo

doi:10.1364/ACPC.2017.Su4D.3

Asia Communications and Photonics Conference
OSA Technical Digest (online) (Optica Publishing Group, 2017),
paper Su4D.3
•https://doi.org/10.1364/ACPC.2017.Su4D.3

2D and 3D Heterogeneously Photonic Integrated Circuits for future Computing and Networking Systems

S. J. Ben Yoo

Asia Communications and Photonics Conference 2017

Guangzhou, Guangdong China
10–13 November 2017
ISBN: 978-1-943580-34-7

From the session
Photonic Integration and Optical Interconnects (Su4D)

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S. J. Ben Yoo, "2D and 3D Heterogeneously Photonic Integrated Circuits for future Computing and Networking Systems," in Asia Communications and Photonics Conference, OSA Technical Digest (online) (Optica Publishing Group, 2017), paper Su4D.3.

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Abstract

We discuss 2D and 3D integration of III–V, group-IV, and crystalline/noncrystalline dielectric materials leading to functional circuits for future computing and networking systems. In particular, we will discuss beyond-Moore’s computing and temporal/spectral/spatial elastic networking systems.

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