A study of overflowed epoxy resin in a butt-coupling with FAB and EML mounted on PCB for a compact optic design of Ethernet 100G/400G CWDM4 data center application

Jyung Chan Lee; Joon Ki Lee; Eun-Gu Lee; Kyeongwan Jeon; Sang Wan Park; Changhyun Kang; Jong Ha Moon

Asia Communications and Photonics Conference (ACPC) 2019
OSA Technical Digest (Optica Publishing Group, 2019),
paper M4A.245

A study of overflowed epoxy resin in a butt-coupling with FAB and EML mounted on PCB for a compact optic design of Ethernet 100G/400G CWDM4 data center application

Jyung Chan Lee, Joon Ki Lee, Eun-Gu Lee, Kyeongwan Jeon, Sang Wan Park, Changhyun Kang, and Jong Ha Moon

Asia Communications and Photonics Conference 2019

Chengdu China
2–5 November 2019
ISBN: 978-1-943580-70-5

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Joint Poster Session (M4A)

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J. C. Lee, J. K. Lee, E. Lee, K. Jeon, S. W. Park, C. Kang, and J. H. Moon, "A study of overflowed epoxy resin in a butt-coupling with FAB and EML mounted on PCB for a compact optic design of Ethernet 100G/400G CWDM4 data center application," in Asia Communications and Photonics Conference (ACPC) 2019, OSA Technical Digest (Optica Publishing Group, 2019), paper M4A.245.

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Abstract

We investigated results of overflowed epoxy resin in a butt-coupling. We could obtain the higher coupling efficiency due to the narrower beam divergence and explain the better heat transfer utilizing conduction and convection mechanism.

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