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Conferences > ACPC > 2020 > M4A > M4A.98
  • Asia Communications and Photonics Conference/International Conference on Information Photonics and Optical Communications 2020 (ACP/IPOC)
  • OSA Technical Digest (Optica Publishing Group, 2020),
  • paper M4A.98
  • •https://doi.org/10.1364/ACPC.2020.M4A.98

Design of Wideband Top Ground MSL for Back-incidence High-speed Photodetector Packaging

Jih-Chin Chen, Bing Xiong, Enfei Chao, Changzheng Sun, Zhibiao Hao, Jian Wang, Lai Wang, Yanjun Han, Hongtao Li, and Yi Luo

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Abstract

Top-ground microstrip line (TGMSL) is designed for high-speed photodetector package. The fabricated TGMSL exhibits a transmission loss below 0.5 dB and a reflection coefficient less than −15 dB up to 40 GHz.

© 2020 The Author(s)

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