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Conferences > ACPC > 2021 > T2D > T2D.2

2.5D Optoelectronic Integration for 400G (8×56Gbps) CPO-based Optical Interconnects

Xuecheng Yang, Jiangbing Du, Jiacheng Liu, Xinyi Wang, Ningfeng Tang, Yingchun Shang, and Zuyuan He

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Abstract

A proof-of-concept 2.5D optoelectronic integration solution for CPO applications is demonstrated, based on organic substrate, silicon photonics, flip-chip. Pre-FEC BER under 0.02 is obtained for 56Gbps OOK signals, indicating feasibility for 400G.

© 2021 The Author(s)

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