Silicon Nanophotonic Waveguide for High Degree Soliton Compression at 2.0 μm

Jiayao Huang; Feng Ye; Qian Li

doi:10.1364/ACPC.2021.T4A.167

Asia Communications and Photonics Conference 2021
Technical Digest Series (Optica Publishing Group, 2021),
paper T4A.167
•https://doi.org/10.1364/ACPC.2021.T4A.167

Silicon Nanophotonic Waveguide for High Degree Soliton Compression at 2.0 μm

Jiayao Huang, Feng Ye, and Qian Li

Asia Communications and Photonics Conference 2021

Shanghai China
24–27 October 2021
ISBN: 978-1-957171-00-5

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J. Huang, F. Ye, and Q. Li, "Silicon Nanophotonic Waveguide for High Degree Soliton Compression at 2.0 μm," in Asia Communications and Photonics Conference 2021, C. Chang-Hasnain, A. Willner, W. Shieh, P. Shum, Y. Su, G. Li, B. Eggleton, R. Essiambre, D. Dai, and D. Ma, eds., Technical Digest Series (Optica Publishing Group, 2021), paper T4A.167.

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Abstract

Numerical simulation of cascaded higher-order soliton compression in the silicon nanophotonic waveguide is reported, where 1 ps initial pulse is compressed to 31.1 fs with a high compression factor of 32.17 at 2.0 μm.

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