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Conferences > AIO > 2022 > M3A > M3A.2

Packaging Integrated Photonic Devices to Increase Scalability Using Laser Fusion Splicing

Juniyali Nauriyal, Meiting Song, Marissa Granados-Baez, Yi Zhang, and Jaime Cardenas

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Abstract

We present a novel technique for attaching fiber-arrays to photonic-chips in single-shot. We demonstrate a minimum loss of -1.4dB and -1.5dB per-facet with a variation of +/-0.2dB and 0.0dB through 8-fiber and 4-fiber arrays respectively.

© 2022 The Author(s)

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