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Conferences > AOE > 2008 > SaK > SaK4
  • Asia Optical Fiber Communication and Optoelectronic Exposition and Conference
  • OSA Technical Digest (CD) (Optica Publishing Group, 2008),
  • paper SaK4
  • •https://doi.org/10.1364/AOE.2008.SaK4

Optical and Thermal Analysis for a Modified Flip-Chip Light Emitting Diode

Chuen-Ching Wang, Wen-Ren Yang, Jin-Jia Chen, Wei-Wen Shih, I-Ju Wang, Tzong-Yih Guo, and Kuang-Lung Huang

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Abstract

The proposed design for modified flip-chip LED (Light Emitting Diode) has average coupling efficiency of 49.6% for misalignment of 0.4~3 mm. The designed ambient environment also improves the thermal efficiency by factor of 1.6.

© 2008 Optical Society of America

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