Abstract
Low roughness relief structures have been fabricated using wet etching in <111> silicon wafer for use as masters for microfluidic systems. The etch rate is about 1 to 3 mm/min. A surface roughness of about 2 nm was measured by the atomic force microscope (AFM). No distortion or variation on the channel width is observed in the circular and Y-branched relief structures.
© 2008 Optical Society of America
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