Research on FBG Packaging Technique for Ultrahigh Resolution Strain Sensing

Jun Cao; Qingwen Liu; Xinyu Fan; Zuyuan He

doi:10.1364/APOS.2016.Th4A.46

Asia Pacific Optical Sensors Conference
OSA Technical Digest (online) (Optica Publishing Group, 2016),
paper Th4A.46
•https://doi.org/10.1364/APOS.2016.Th4A.46

Research on FBG Packaging Technique for Ultrahigh Resolution Strain Sensing

Jun Cao, Qingwen Liu, Xinyu Fan, and Zuyuan He

Asia-Pacific Optical Sensors Conference 2016

Shanghai China
11–14 October 2016
ISBN: 978-0-9600380-5-3

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Poster Session II (Th4A)

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J. Cao, Q. Liu, X. Fan, and Z. He, "Research on FBG Packaging Technique for Ultrahigh Resolution Strain Sensing," in Asia Pacific Optical Sensors Conference, OSA Technical Digest (online) (Optica Publishing Group, 2016), paper Th4A.46.

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Abstract

We reported a new FBG packaging method with both good long time stability and simple field assembly by fixing metallized fiber to metal board with V-shaped groove, for the purpose of ultrahigh strain sensing.

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