Abstract

Planarization of photosensitive device technology promises to significantly expand the application options for this type of material. Current use of hydrogen techniques have successfully produced strongly photosensitive thin-films, but require complex manufacturing processes and preclude in-situ writing of optical interconnects. We will report on the production of highly photosensitive thin films, without the use of post-deposition processing, which promise compatibility and integrability with III-V and Si processing. We will demonstrate a number of device structures with unique optical functionality in our films.

© 1997 Optical Society of America