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Conferences > CLEO > 1984 > THH > THH3

Laser-jet electrodeposition of gold and copper

R. J. Von Gutfeld, M. H. Gelchinski, D. R. Vigliottl, and L. T. Romankiw

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Abstract

Results on laser-enhanced electroplating of gold and copper have been described in several earlier references.1,2 Recently, It was shown that the limitation on the plating rates for gold is principally due to mass transport, that is, the lack of an adequate resupply of ions to the region undergoing deposition.3 Evidence of this was found from both the surface and cross-sectional morphology of gold samples deposited in conditions of high-current density.3

© 1984 Optical Society of America

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