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Perspectives on laser processing technology for microelectronics

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Abstract

The drive toward submicron technologies is demanding new microfabrication techniques capable of increased flexibility, personalization, and post-mass production correction of circuitry errors. The utilization of laser beams for direct writing, localized deposition, etching, and doping is currently being developed to meet these new fabrication challenges.

© 1985 Optical Society of America

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