Abstract
The production of wafer-scale integrated circuits currently requires the employment of redundancy to avoid defective circuit elements. The restructurable VLSI approach at MIT Lincoln Laboratory uses laser pulses to form low-resistance contacts between metal bus lines separated by an insulator and to cut lines to interconnect operable circuit blocks.1 Two wafer-scale digital integrator circuits with 130,000 transistors each have been laser interconnected,2 and one has operated continuously for 1 yr. A second wafer design has been linked to produce three operating circuits with over 300,000 transistors. One is a constant false alarm rate digital filter,3 while the others are sixteen-point fast Fourier transform systems. This design illustrates the user customization feature of laser linking whereby the same wafer resources are employed to generate entirely different system functions by simply modifying the interconnection paths.
© 1986 Optical Society of America
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