Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group

Enhanced operation of wafer-scale circuits using nitrided a-Si laser links

Not Accessible

Your library or personal account may give you access

Abstract

The production of wafer-scale integrated circuits currently requires the employment of redundancy to avoid defective circuit elements. The restructurable VLSI approach at MIT Lincoln Laboratory uses laser pulses to form low-resistance contacts between metal bus lines separated by an insulator and to cut lines to interconnect operable circuit blocks.1 Two wafer-scale digital integrator circuits with 130,000 transistors each have been laser interconnected,2 and one has operated continuously for 1 yr. A second wafer design has been linked to produce three operating circuits with over 300,000 transistors. One is a constant false alarm rate digital filter,3 while the others are sixteen-point fast Fourier transform systems. This design illustrates the user customization feature of laser linking whereby the same wafer resources are employed to generate entirely different system functions by simply modifying the interconnection paths.

© 1986 Optical Society of America

PDF Article
More Like This
Interconnection and testing of a wafer-scale circuit with laser processing

G. H. Chapman, A. H. Anderson, K. H. Konkle, B. Mathur, J. I. Raffel, and A. M. Soares
FD3 Conference on Lasers and Electro-Optics (CLEO:S&I) 1984

Laser-diffused link for wafer-scale Integration using standard CMOS processing

J. M. CANTER, G. H. CHAPMAN, and J. I. RAFFEL
THM7 Conference on Lasers and Electro-Optics (CLEO:S&I) 1988

Laser linking process for restructurable VLSI

G. H. Chapman, J. I. Raffel, J. A. Yasaitis, and S. M. Cheston
THD1 Conference on Lasers and Electro-Optics (CLEO:S&I) 1982

Select as filters


Select Topics Cancel
© Copyright 2024 | Optica Publishing Group. All Rights Reserved