Carbon dioxide and excimer laser ablation of parylene

YUN-YEN J. YANG; SHYAN-JER LEE; SUSAN D. ALLEN

Conference on Lasers and Electro-Optics
OSA Technical Digest (Optica Publishing Group, 1989),
paper THD5

Carbon dioxide and excimer laser ablation of parylene

YUN-YEN J. YANG, SHYAN-JER LEE, and SUSAN D. ALLEN

Conference on Lasers and Electro-Optics 1989

Baltimore, Maryland United States
24–28 April 1989
ISBN: 1-55752-086-0

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Laser Photoablation (THD)

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Y. J. YANG, S. LEE, and S. D. ALLEN, "Carbon dioxide and excimer laser ablation of parylene," in Conference on Lasers and Electro-Optics, R. Bartolini, P. Liao, J. Bufton, and W. Krupke, eds., Vol. 11 of OSA Technical Digest (Optica Publishing Group, 1989), paper THD5.

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Abstract

Laser-induced ablation of polymers has been studied intensively in recent years because of its potential applications in microelectronic and surgical sectors.¹ UV excimer laser etching of PMMA and polyimide, two polymers widely used as dielectric materials in the semiconductor industry, has been thoroughly investigated.

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