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Optica Publishing Group
  • Conference on Lasers and Electro-Optics
  • OSA Technical Digest (Optica Publishing Group, 1990),
  • paper CWF57

Direct-write photoablation at high writing rates with waveguide excimer lasers

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Abstract

The average rate at which material can be removed in direct-write photoablation is a function of material parameters (threshold fluence, single shot ablation depth), laser parameters (pulse energy, repetition rate), and the desired depth of cut. In general, writing rates are directly proportional to the laser pulse repetition frequency (prf) and inversely proportional to the required spatial resolution. When the spatial resolution is <100 μm, laser pulse energy requirements are modest, and the pulse repetition rate becomes an increasingly important factor infuencing writing rates.

© 1990 Optical Society of America

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