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  • Conference on Lasers and Electro-Optics
  • OSA Technical Digest (Optica Publishing Group, 1992),
  • paper CThG5

Backside optical detection of electrical signals in CMOS integrated circuits

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Abstract

As the complexity and performance of silicon integrated circuits (ICs) increases, testing and debugging these circuits become more challenging. Current-generation ICs have four or more layers of metallization in the circuit and are flip-chip mounted to a high performance IC carrier.1 Because of this complexity, internal nodes in the circuit are not accessible to conventional e-beam or electrical probes.

© 1992 Optical Society of America

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