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  • Conference on Lasers and Electro-Optics
  • OSA Technical Digest (Optica Publishing Group, 1993),
  • paper CThE8

Scalable high average power diode arrays using microchannel cooling

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Abstract

Figures 1 and 2 show diagrams of a modular microchannel cooled heatsink that we have designed and demonstrated. The principal difference between the present package and our previously demonstrated package1 is the incorporation of an edge-mounted laser diode array and a package thinning. The edge-mounted diode allows compatibility with the cylindrical microlens technology developed at Lawrence Livemore National Laboratory which enables the collimation of the fast axis of the laser diode arrays to 10 mrad. The thinner package allows stacking pitches of 10 per centimeter and is responsible for our being able to demonstrate an increased average irradiance exceeding 120 W/cm2.

© 1993 Optical Society of America

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