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Optica Publishing Group
  • Conference on Lasers and Electro-Optics
  • OSA Technical Digest (Optica Publishing Group, 1996),
  • paper CFH1

Optoelectronic VLSI switching chip with greater than 4000 optical I/O based on flip-chip bonding of GaAs/AIGaAs MQW modulators and detectors to silicon CMOS

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Abstract

Optical interconnections between electronic devices is expected to alleviate the communication bottleneck that exists in today's electronic switching and computing systems. A particularly attractive approach is to integrate the optical detectors and modulators or sources directly onto electronic circuitry. Up to now, circuits such as these are limited in speed, such as ferroelectric liquid crystal devices,1 or complexity, such as monolithic field-effect transistor self-electrooptic effect devices (FET-SEEDs).2 The hybrid integration of multiple quantum well modulators with silicon CMOS offers the potential for both high speed and high complexity. Circuits made using bump-bonding techniques3–8 have achieved 16 K optical I/O in a spatial light modulate/ and 1 Gbit/s in receiver transmitter pairs.7

© 1996 Optical Society of America

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