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Optica Publishing Group
  • Conference on Lasers and Electro-Optics
  • OSA Technical Digest (Optica Publishing Group, 1996),
  • paper CTuW7

Packaging of a monolithic microwave/ optical receiver chip with an optical fiber

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Abstract

Monolithic optoelectronic integrated circuit (OEIC) receivers are becoming important in high-speed digital and microwave communication systems. Monolithic integration of the photodetector with the receiver electronics decreases the parasitics, thus enabling high-speed operation, Recently, metal-semiconductor-metal (MSM) photodetectors have become attractive for OEIC receivers, because of their planar structure, low-capacitance and their compatibility with MESEET/HEMT circuitry.1 Here, we report on the design and operation of a high-speed monolithically integrated GaAs receiver with MSM photodetector. We also report on a packaging approach to reliably couple light from an optical fiber on to the planar detector. This approach utilizes Si V-groove technology and flip-chip bonding to achieve the required alignment tolerances, A schematic diagram of the packaging approach is shown in Fig. 1.

© 1996 Optical Society of America

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