Ion-exchange across a direct-bonded Interface

C.B.E. Gawith; T. Bhutta; D.P. Shepherd; P. Hud; G.W. Ross; P.G.R. Smith; J. Wang

Conference on Lasers and Electro-Optics
OSA Technical Digest (Optica Publishing Group, 2000),
paper CWK37

Ion-exchange across a direct-bonded Interface

C.B.E. Gawith, T. Bhutta, D.P. Shepherd, P. Hud, G.W. Ross, P.G.R. Smith, and J. Wang

Conference on Lasers and Electro-Optics 2000

San Francisco, California United States
7–11 May 2000
ISBN: 1-55752-634-6

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C. B. E. Gawith, T. Bhutta, D. P. Shepherd, P. Hud, G. W. Ross, P. G. R. Smith, and J. Wang, "Ion-exchange across a direct-bonded Interface," in Conference on Lasers and Electro-Optics, S. Brueck, R. Fields, M. Fejer, and F. Leonberger, eds., OSA Technical Digest (Optica Publishing Group, 2000), paper CWK37.

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Abstract

Presented are the results of our initial study towards producing buried waveguides in BK-7 glass by intersubstrate ion-exchange. This method uses the direct bonding (DB)^1,2 technique to provide a region of atomic contact between two BK-7-type substrates, compositionally designed to create opposing potassium and sodium concentration gradients across the bonded interface, between which ionexchange can take place.

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