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Optica Publishing Group
  • Conference on Lasers and Electro-Optics
  • OSA Technical Digest (Optica Publishing Group, 2002),
  • paper CThA2

Finite Difference Analysis of Thermal Characteristics of Continuous Wave Operation 850 nm Lateral Current Injection and Implant-apertured VCSEL with Flip-chip Bond Design

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Abstract

The VCSELs of this work are based on an im- planted-aperture, index-guided, lateral current- injected, top dielectric mirror GaAs quantum well 850 nm design. The VCSELs were tested with the light signal propagated through 300 meters of optical fiber and a propagation rate of 11.5 Gb/s and bit error rates below 10−14 were obtained.1,2 The thermal simulation employs Quasi-three dimensional finite difference analysis to calculate the temperature, T(r, z), thermal resistance and the rise time of temperature at a fixed bias to calculate the non-uniform heat source distribution. Carrier diffusion and distributed heat sources inside the active layer were also included. In addition, we have also simulated temperature distributions in the different layers comprising the lasers and estimated the rise time of temperature at a fixed bias.

© 2002 Optical Society of America

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