Abstract
A photoimageable material has been developed for optical interconnect applications. In addition to having excellent imaging, thermal stability and optical loss properties, the material is compatible with standard lithographic processing including aqueous base developing.
© 2003 Optical Society of America
PDF ArticleMore Like This
Jürgen Schrage and Thomas Bierhoff
WDD4 Frontiers in Optics (FiO) 2003
G. Khanarian, Y. You, M. Talley, R. Gore, S. Ibbitson, A. Lamola, M. Gallagher, B. Sicard, M. Moynihan, and J. Shelnut
CMT7 Conference on Lasers and Electro-Optics (CLEO:S&I) 2003
K. Tamaki, T. Utaka, H. Takase, and Y. Eriyama
MF51 Optical Fiber Communication Conference (OFC) 2003