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Conferences > CLEOPR > 2013 > WPE > WPE_6
  • 2013 Conference on Lasers and Electro-Optics Pacific Rim
  • (Optica Publishing Group, 2013),
  • paper WPE_6

Three-Dimensional Micro Modification and Selective Etching of Crystalline Silicon Using 1.56-μm Subpicosecond Laser Pulses

Shigeki Matsuo, Keiji Oda, and Yoshiki Naoi

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Abstract

Three dimensional micro removal processing was attempted to crystalline silicon substrate using a 1.56-μm subpicosecond laser. Selective removal was observed on both top and rear surfaces when nitric hydrofluoric acid was used as etchant.

© 2013 IEICE

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