Abstract

Ultrashort laser pulses can be used to directly join transparent substrates by localized melting and resolidification without any intermediate layers. I review recent advance of welding and joining of glass substrates with ultrashort laser pulses.

© 2013 Optical Society of America

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More Like This
Welding of glass/glass and Si/glass using ultrashort laser pulses

I. Miyamoto
CM_3LIM_1 The European Conference on Lasers and Electro-Optics (CLEO_Europe) 2013

Plasmonics for rapid laser micro-joining of dielectrics

S. A. Zolotovskaya, Z. Wang, and A. Abdolvand
CM_P_6 The European Conference on Lasers and Electro-Optics (CLEO_Europe) 2015

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D. Paipulas, V. Mizeikis, A. Čerkauskaitė, V Sirutkaitis, and S. Juodkazis
CM_7_5 The European Conference on Lasers and Electro-Optics (CLEO_Europe) 2013