Fast femtosecond laser ablation for efficient cutting of sintered alumina and quartz substrates

Reece N. Oosterbeek; Reece N. Oosterbeek; Reece N. Oosterbeek; Thomas Ward; Thomas Ward; Thomas Ward; Carsten Corazza; Carsten Corazza; Carsten Corazza; Owen Bodley; Owen Bodley; Owen Bodley; Simon Ashforth; Simon Ashforth; Simon Ashforth; Andrew Rodda; M. Cather Simpson; M. Cather Simpson; M. Cather Simpson; M. Cather Simpson

doi:10.1364/CLEO_AT.2016.JW2A.11

Conference on Lasers and Electro-Optics
OSA Technical Digest (online) (Optica Publishing Group, 2016),
paper JW2A.11
•https://doi.org/10.1364/CLEO_AT.2016.JW2A.11

Fast femtosecond laser ablation for efficient cutting of sintered alumina and quartz substrates

Reece N. Oosterbeek, Thomas Ward, Carsten Corazza, Owen Bodley, Simon Ashforth, Andrew Rodda, and M. Cather Simpson

CLEO: Applications and Technology 2016

San Jose, California United States
5–10 June 2016
ISBN: 978-1-943580-11-8

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Poster Session - Wednesday (JW2A)

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R. N. Oosterbeek, T. Ward, C. Corazza, O. Bodley, S. Ashforth, A. Rodda, and M. C. Simpson, "Fast femtosecond laser ablation for efficient cutting of sintered alumina and quartz substrates," in Conference on Lasers and Electro-Optics, OSA Technical Digest (online) (Optica Publishing Group, 2016), paper JW2A.11.

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Abstract

Ultrafast laser machining of ceramic and crystalline substrates offers many benefits versus mechanical dicing. We optimized femtosecond laser parameters for cutting industry sintered alumina and quartz wafers, yielding drastic improvements in cutting speed and quality.

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