High-throughput ultrafast laser micromachining with multiple parallel spots

Stephan Bruening; Keming Du; Arnold Gillner

doi:10.1364/CLEO_AT.2022.AM3I.3

Conference on Lasers and Electro-Optics
Technical Digest Series (Optica Publishing Group, 2022),
paper AM3I.3
•https://doi.org/10.1364/CLEO_AT.2022.AM3I.3

High-throughput ultrafast laser micromachining with multiple parallel spots

Stephan Bruening, Keming Du, and Arnold Gillner

CLEO: Applications and Technology 2022

San Jose, California United States
15–20 May 2022
ISBN: 978-1-957171-05-0

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Industrial Applications in Laser Microprocessing (AM3I)

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S. Bruening, K. Du, and A. Gillner, "High-throughput ultrafast laser micromachining with multiple parallel spots," in Conference on Lasers and Electro-Optics, Technical Digest Series (Optica Publishing Group, 2022), paper AM3I.3.

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Abstract

The parallel use of a large number of ultrashort pulsed laser beams with individual power modulation creates a completely new digital controllable tool in surface processing. High performance ultrashort pulsed lasers allow the material independent processing in nanometer accuracy, even for large components.

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