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Creation of high-aspect-ratio microchannels inside silicon with three-dimensional laser lithography

Muhammad Ahsan Tauseef, Rana Asgari Sabet, and Onur Tokel

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Abstract

Here, we demonstrate for the first-time, high-aspect-ratio microchannels inside silicon wafers, exploiting modulated lasers beams. The optical quality of the top wafer surface is preserved for further on-chip, in-chip integration.

© 2022 The Author(s)

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