Single-pulse Laser Induced Buried Defects in Silicon Written by Ultrashort-pulse Laser at 2.1 um

N. Tolstik; N. Tolstik; E. Sorokin; J.C. Mac-Cragh; R. Richter; Irina T. Sorokina; Irina T. Sorokina

doi:10.1364/CLEO_AT.2022.AM4I.8

Conference on Lasers and Electro-Optics
Technical Digest Series (Optica Publishing Group, 2022),
paper AM4I.8
•https://doi.org/10.1364/CLEO_AT.2022.AM4I.8

Single-pulse Laser Induced Buried Defects in Silicon Written by Ultrashort-pulse Laser at 2.1 um

N. Tolstik, E. Sorokin, J.C. Mac-Cragh, R. Richter, and Irina T. Sorokina

CLEO: Applications and Technology 2022

San Jose, California United States
15–20 May 2022
ISBN: 978-1-957171-05-0

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Laser-Based Device Fabrication (AM4I)

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N. Tolstik, E. Sorokin, J. C. Mac-Cragh, R. Richter, and I. T. Sorokina, "Single-pulse Laser Induced Buried Defects in Silicon Written by Ultrashort-pulse Laser at 2.1 um," in Conference on Lasers and Electro-Optics, Technical Digest Series (Optica Publishing Group, 2022), paper AM4I.8.

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Abstract

We report sub-wavelength micrometer-sized buried defects induced in silicon by single ultrashort laser pulses at 2.09 µm. We also report laser-induced depressed cladding waveguide and other 3D-structures, and demonstrate waveguiding.

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