Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group
  • CLEO/Europe and EQEC 2011 Conference Digest
  • OSA Technical Digest (CD) (Optica Publishing Group, 2011),
  • paper CM_P16

Controllable Bumps and Holes Fabrication on the Surface of Fused Silica by Processing Bulk Material with Ultrashort Laser Pulses

Not Accessible

Your library or personal account may give you access

Abstract

Processing of bulk transparent dielectrics with ultrashort laser pulses is widely used for direct writing of waveguides, gratings, couplers and other photonics devices inside the volume of material [1]. This technique is based on the modification of bulk glass material or voids formation, which depends on processing conditions.

© 2011 Optical Society of America

PDF Article
More Like This
Ultrashort Pulse Laser Materials Processing

Stefan Nolte
CM_5_1 The European Conference on Lasers and Electro-Optics (CLEO/Europe) 2017

Volume processing of transparent materials by ultrashort laser pulses: potential and applications

S. Nolte, K. Bergner, R. Krämer, D. Richter, S. Richter, C. Voigtländer, and F. Zimmermann
26B2_1 Conference on Lasers and Electro-Optics/Pacific Rim (CLEO/PR) 2015

In-volume waveguides by femtosecond laser double pulses in glass materials

D. Esser, J. Kumstel, and J. Gottmann
CM_P4 The European Conference on Lasers and Electro-Optics (CLEO/Europe) 2011

Select as filters


Select Topics Cancel
© Copyright 2024 | Optica Publishing Group. All rights reserved, including rights for text and data mining and training of artificial technologies or similar technologies.