Abstract

Application specific photonic integrated circuits (ASPICs) are the new generation of optoelectronic devices that may be effectively deployed in optical communication systems of the future [1]. The most significant advantages of PICs are small size and weight, high efficiency and low power consumption. Nowadays, a novel, standardized method for fabrication of ASPICs has been developed within the framework of the EU FP7 projects EuroPIC and PARADIGM [2]. It is based on a generic integration concept [3], which assumes that complex photonic circuits with multiple functionalities can be designed and manufactured using a limited set of standardized and parameterized basic building blocks.

© 2013 IEEE