Abstract

Power scaling of microchip lasers with high-beam quality, robustness, reliability and simplicity is desirable for industrial and medical applications. The main point in designing high-power small-size lasers is related to heat removal management. One solution for improved heat transfer is to decrease the active medium thickness until the heat flows axially [1-4]. Thus, when the medium thickness is reduced to hundreds of microns the thermal induced lens almost disappears and heat transfer is dramatically improved. However, a thin thickness comes with low absorption, which requires multi-pass absorption [2]. Alternatively, efficient composite edge-pumped thin disk needs more optical systems to insert laser diode pump beam through the crystal’s edge [3].

© 2015 IEEE