Abstract
Ultrashort laser pulses allow the cold ablation material processing, because the energy is deposited in a time duration similar to or shorter than thermal diffusion time, leading to the high surface quality with precise patterning depth and without grooves, rims or visible melting damage [1]. The commercially available laser systems offer either longer picosecond pulses (10-50 ps) with higher average power (~100 W) or shorter sub-picosecond pulses (0.5-1 ps) with up to ~50-80 W of average power. Due to the throughput scalability of industrial processes, there is a high demand for even higher average power. Shorter, sub-ps pulses increase the ablation efficiency and etch (material removal) rate for some materials (e.g. steel) [2]. In this work, we present the state-of-the-art 160 W 800 fs laser system, which is ideally suited for high speed surface processing.
© 2015 IEEE
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