Abstract
The bulk of commercially available vertical-cavity surface-emitting lasers (VCSELs) today relies on buried AlxOy oxide apertures for current confinement [1]. Excellent operation behavior is achieved. Nevertheless, mesa etching and wet-thermal oxidation are additional production steps which require tight process control. Moreover, due to volume shrinkage of the oxidized layers, strain is incorporated close to the active region, which gives rise to concerns about device reliability [2].
© 2015 IEEE
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