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Conferences > CLEO_Europe > 2021 > cm_2 > cm_2_3
  • 2021 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference
  • OSA Technical Digest (Optica Publishing Group, 2021),
  • paper cm_2_3

Laying the foundations of ultrafast stealth dicing of silicon with picosecond laser pulses at 2-µm wavelength

Markus Blothe, Maxime Chambonneau, Tobias Heuermann, Martin Gebhardt, Jens Limpert, and Stefan Nolte

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Abstract

Transversally elongated modifications were induced into the bulk of silicon with 2-m picosecond laser pulses. The modified samples showed a reduced breaking strength and may serve in future for dicing applications.

© 2021 IEEE

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