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A Comparison of Metal Adhesion Layers for Au Films in Thermo-Plasmonic Applications

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Abstract

The dewetting resistance of Au 50 nm films fabricated atop Ti/Ta/W/Cr/Al adhesion layers (0.5-5 nm) was investigated. Results show sub-nanometer Ta has superior stability under thermal stress, while W & Ti show best plasmonic response.

© 2019 The Author(s)

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