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Conferences > CLEO_SI > 2013 > JTh2A > JTh2A.07

Backside Surface Machining of Silicon Wafers Using a Nanosecond Tm:fiber MOPA System

Lawrence Shah, Tobias Bonhoff, Ashraf F. El-Sherif, Pankaj Kadwani, Martin Gebhardt, Christian Gaida, Ilya Migareev, and Martin Richardson

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Abstract

We report on selective machining of the back surface machining of double-side polished silicon wafers, using a high peak power nanosecond Tm:fiber master oscillator power amplifier with a photonic crystal fiber based power amplifier.

© 2013 Optical Society of America

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