Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group

Heterogeneous 2D and 3D Photonic Integration for Future Chip-Scale Microsystems

Not Accessible

Your library or personal account may give you access

Abstract

This tutorial reviews state-of-the-art heterogeneous 2D/3D photonic integration technologies involving various novel fabrication techniques leading to realization of chip-scale microsystems with photonic-electronic-integrated-circuits. Future prospects and challenges in computing and networking applications will also be discussed.

© 2015 Optical Society of America

PDF Article
More Like This
2D and 3D Heterogeneous Photonic Integrated Circuits

S. J. Ben Yoo
Th1C.5 Optical Fiber Communication Conference (OFC) 2016

2D and 3D Heterogeneous Photonic Integration for Future Microsystems

S. J. Ben Yoo
AS3A.1 Asia Communications and Photonics Conference (ACPC) 2015

3D Integrated Photonic Technologies for Future Functional Microsystems

S. J. Ben Yoo
SM4G.6 CLEO: Science and Innovations (CLEO_SI) 2016

References

You do not have subscription access to this journal. Citation lists with outbound citation links are available to subscribers only. You may subscribe either as an Optica member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access Optica Member Subscription

Select as filters


Select Topics Cancel
© Copyright 2022 | Optica Publishing Group. All Rights Reserved