Author Affiliations

Jacob Rada,^a Haifeng Hu,^b Lyu Zhou,^a Jing Zeng,^c Haomin Song,^a Xie Zeng,^a Shakil Shimul,^d Wen Fan,^e Qiwen Zhan,^b Wei Li,^d Limin Wu,^c and Qiaoqiang Gan^a,*

^aDepartment of Electrical Engineering, The State University of New York at Buffalo, Buffalo, NY 14260

^bSchool of Optical-Electrical and Computer Engineering, University of Shanghai for Science and Technology, Shanghai 20093, China

^cDepartment of Materials Science, Fudan University, Shanghai 200433, China

^dDepartment of Chemical Engineering, Texas Tech University, Lubbock, TX 79409, USA

^eSchool of Materials Science and Engineering, Hubei University, Wuhan, Hubei 430062, China

^*Corresponding author: qqgan@buffalo.edu