Toward photoelastic sensors: a hybrid proposal for imaging the stress field through load stepping methods

Juan C. Briñez-de León; Juan C. Briñez-de León; Juan C. Briñez-de León; John W. Branch; Alejandro Restrepo-M; Alejandro Restrepo-M

doi:10.1364/COSI.2020.CTh3C.4

Imaging and Applied Optics Congress
OSA Technical Digest (Optica Publishing Group, 2020),
paper CTh3C.4
•https://doi.org/10.1364/COSI.2020.CTh3C.4

Toward photoelastic sensors: a hybrid proposal for imaging the stress field through load stepping methods

Juan C. Briñez-de León, John W. Branch, and Alejandro Restrepo-M

Computational Optical Sensing and Imaging 2020

Washington, DC United States
22–26 June 2020
ISBN: 978-1-943580-77-4

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Unconventional Imaging (CTh3C)

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J. C. Briñez-de León, J. W. Branch, and A. Restrepo-M, "Toward photoelastic sensors: a hybrid proposal for imaging the stress field through load stepping methods," in Imaging and Applied Optics Congress, OSA Technical Digest (Optica Publishing Group, 2020), paper CTh3C.4.

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Abstract

Extending photoelasticity studies to industrial applications, such as photoelastic sensors, implies to overcome limitations like need of experts, experimental over-calibration, or reduced number of experiments. This paper introduces a computational hybrid technique toward this goal.

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