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  • Applications of Diamond Films and Related Materials: Third International Conference
  • Technical Digest Series (Optica Publishing Group, 1995),
  • paper DCT213

Microcutting Characteristics on the Single Crystal Diamond Tool with Edge Radius Using Molecular Dynamics

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Abstract

Ultrprecision metal cutting(UPMC) technology which makes possible submicrometer form accuracy and nanometer roughness is devloped to reach the 1nm nominal(undeformd) thickness of cut. At this thickness level, a few of atom’s layers should be considered. In this paper using the Molecuar Dynamics simulation, the phenomena of microcutting with a subnanometer chip thickness, the cutting mechanism for tool edge configuration to consider the sharp edge and round edge tool, the cut material and cutting speed are evaluated. Cutting mechanism of subnanometer depth of cut is evaluated.

© 1995 Optical Society of America

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