3D Imaging of Electrical-Thermal-Mechanical Deformation on Bonding Wire Loops using Phase-Sensitive Line-field Optical Coherence Tomography

Zhiyi Zhao; Zhiyi Zhao; Zhiyi Zhao; Zijian Zhang; Zijian Zhang; Zijian Zhang; Xingyu Yang; Xingyu Yang; Xingyu Yang; Yihua Hu; Yihua Hu; Yihua Hu; Ju Xu; Ju Xu; Ju Xu; Yaochun Shen; Yaochun Shen; Yaochun Shen

doi:10.1364/DH.2022.Tu4A.2

Digital Holography and 3-D Imaging 2022
Technical Digest Series (Optica Publishing Group, 2022),
paper Tu4A.2
•https://doi.org/10.1364/DH.2022.Tu4A.2

3D Imaging of Electrical-Thermal-Mechanical Deformation on Bonding Wire Loops using Phase-Sensitive Line-field Optical Coherence Tomography

Zhiyi Zhao, Zijian Zhang, Xingyu Yang, Yihua Hu, Ju Xu, and Yaochun Shen

Digital Holography and Three-Dimensional Imaging 2022

Cambridge United Kingdom
1–4 August 2022
ISBN: 978-1-957171-12-8

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Phase Processing, Retrieval Techniques, and Applications I (Tu4A)

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Z. Zhao, Z. Zhang, X. Yang, Y. Hu, J. Xu, and Y. Shen, "3D Imaging of Electrical-Thermal-Mechanical Deformation on Bonding Wire Loops using Phase-Sensitive Line-field Optical Coherence Tomography," in Digital Holography and 3-D Imaging 2022, D. Chu, J. Park, C. Cheng, and P. Ferraro, eds., Technical Digest Series (Optica Publishing Group, 2022), paper Tu4A.2.

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Abstract

The repetitive electrical-thermal-mechanical deformation causes bonding wires failures that can damage whole power electronic modules. The LF-OCT can measure electrical-thermal-mechanical deformation on a bonding wire's loop, which can help the reliability analysis of bonding wires.

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