Abstract

The advancement of semiconductor laser materials growth and device fabrication technology has brought the cost of the laser chip well below the cost of the associated optics, precision alignment, and packaging required to effectively utilize the device in systems applications.¹ We report here a novel compact packaging approach that utilizes unique microlenses for simplified lens support and alignment In this scheme, a microlens fabricated on a planar substrate is directly attached to the laser/heatsink to form a precision optical assembly providing a collimated (or focused) output beam. The approach is applicable to either single lasers or laser arrays.

© 1996 Optical Society of America