Abstract
The melding of silicon electronic processing circuits with GaAs quantum well optical modulators and receivers provides the opportunity to significantly increase system communication throughput by virtue of integrated high-speed, free-space, optical channels as demonstrated in a recent experiment1. A second accomplishment of this experiment, the mounting of the optical platform in an electronics cabinet, illustrates the progress toward adapting the optical infrastructure to more traditional packaging schemes. The challenge of blending opto-electronic techniques into contemporary electronic architectures lies in further reducing the opto-mechanical system volume and cost.
© 1996 Optical Society of America
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